HKPC Collaborates with JinTech Semiconductor to Advance Smart Microelectronics Manufacturing in Hong Kong
April 2024 | Hong Kong — The Hong Kong Productivity Council (HKPC) and JinTech Semiconductor Limited have officially signed a Memorandum of Understanding (MoU), marking a strategic partnership to promote innovation, industrialisation, and talent development in Hong Kong’s semiconductor industry.
This milestone collaboration delivers two industry “firsts”:
It is HKPC’s first cross-disciplinary partnership focused on smart microelectronics manufacturing.
JinTech Semiconductor becomes the first semiconductor testing company to establish operations in Hong Kong.
Leveraging HKPC’s leading-edge technologies and JinTech’s expertise in memory wafer testing and storage-grade packaging, the two parties will co-develop a customised, sustainable “Microfactory” model tailored for Hong Kong. This initiative aims to drive smart manufacturing in die grading and packaging, while advancing workforce training and industrial innovation.
The collaboration is expected to accelerate Hong Kong’s transformation into a world-class I&T centre and smart city, contributing to the city’s vision for new productive forces and industrial upgrading.
